专利名称：Low cost high frequency device package and
methods
发明人：Eric A. Sanjuan,Sean S. Cahill申请号：US13485573申请日：20120531公开号：US09275961B2公开日：20160301
专利附图：
摘要：A low-cost high-frequency electronic device package and associated fabricationmethod are described wherein waveguide structures are formed from the high frequencydevice to the package lead transition. The package lead transition is optimized to take
advantage of waveguide interconnect structure.
申请人：Eric A. Sanjuan,Sean S. Cahill
地址：San Jose CA US,Palo Alto CA US
国籍：US,US
代理机构：DeLio, Peterson & Curcio LLP
代理人：Robert Curcio
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